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In most cases, copper busbars achieve the best balance in terms of conductivity, mechanical strength, and long-term reliability.
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When weight, cost, or a larger cross-sectional area margin dominates, aluminum busbars are superior.
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For high-reliability or high-frequency applications, silver plating (or tin plating when on a budget) is a critical enhancement.
When selecting the "best" metal, it is essential to weigh electrical performance against mechanical, environmental, and economic factors to find the ideal solution for a specific busbar installation.
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Silver has the highest conductivity of all metals, but its high cost and tendency to tarnish often preclude its use as a bulk busbar material.
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Copper offers excellent conductivity, mechanical strength, and ease of installation, making it the industry standard for most busbar applications.
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When space or weight is limited, aluminum is a lightweight and cost-effective alternative, but it requires a larger cross-sectional area and careful joint design to mitigate oxidation and thermal expansion issues.
Surface treatments (most commonly silver or tin plating) are often used on copper or aluminum busbars to stabilize contact resistance and extend service life in harsh environments.
Common Busbar Materials
Busbars are typically made from copper, aluminum, or brass, with each material selected based on a balance of electrical, mechanical, and economic factors. Copper busbars dominate in switchgear, distribution panels, and battery packs due to their excellent conductivity and mechanical strength. Although aluminum busbars have lower conductivity per cross-sectional area, they can significantly reduce weight and cost, making them attractive for large distribution systems and applications with strict weight constraints. Brass and steel are rarely used due to their significantly lower conductivity, making them unsuitable for high-current applications.
Conductivity vs. IACS Ratings Comparison
Material
|
Conductivity (MS/m)
|
Conductivity (S/m)
|
IACS Rating (%)
|
Features
|
Silver
|
63.0
|
6.30 × 10⁷
|
106%
|
Highest conductivity, mainly used in high-end applications
|
Copper
|
59.6
|
5.96 × 10⁷
|
100% (Standard)
|
Benchmark for electrical conductors
|
Aluminum
|
35.0
|
3.50 × 10⁷
|
61%
|
Low density, conductivity per unit mass is about twice that of copper
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Mechanical and Thermal Properties Comparison
Material
|
Density
|
Modulus of Elasticity
|
Mechanical Strength
|
Coefficient of Thermal Expansion
|
Creep Resistance
|
Special Considerations
|
Copper
|
High
|
High
|
High
|
Medium
|
Good
|
Requires less support, more compact structure
|
Aluminum
|
Low
|
Medium
|
Medium
|
High
|
Prone to creep
|
Requires special connectors and torque control
|
-
|
-
|
-
|
-
|
-
|
-
|
For high frequencies, consider skin effect and heat dissipation design
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Corrosion, Oxidation and Surface Treatment
Material
|
Oxidation Characteristics
|
Surface Treatment Options
|
Features
|
Precautions
|
Aluminum
|
Easily oxidized
|
Anti-oxidation compounds, coatings
|
Oxide layer is stable but has poor conductivity
|
Reduce contact resistance, prevent joint loosening
|
Copper
|
Stable
|
Silver plating, tin plating
|
Low contact resistance, good corrosion resistance
|
Coating still recommended in corrosive environments
|
Silver Plating
|
Excellent
|
-
|
Gold standard, excellent thermal stability, long lifespan
|
May lose luster but performance remains
|
Tin Plating
|
Good
|
-
|
Good solderability, economical and practical
|
Slightly lower performance than silver but cost-effective
|
Cost, Availability and Practicality
Material
|
Material Cost
|
Conductivity per Unit Mass
|
Space Requirement
|
Application Scenarios
|
Economic Efficiency
|
Aluminum
|
About 1/3 that of copper
|
Twice that of copper
|
Advantageous when space is ample
|
Large-scale busbars, cost-sensitive scenarios
|
Excellent
|
Copper
|
High
|
Standard
|
Preferred in compact designs
|
Widely used in industrial and commercial applications
|
Strong overall performance
|
Silver/Gold
|
Extremely high
|
Slightly better than copper
|
Usable even when space is not a concern
|
Aerospace, satellites, laboratories
|
Very poor (only for high-end use)
|